IC封装用散热片-Hat Heat Slug
IC封装用散热片, 使用导热性佳、质轻、易加工之金属材料(多为铝或铜), 贴附于IC发热表面，
以复合的热交换模式来散热。封装后产品主要应用于5G相关晶片模组与消费性电子产品。
华震科技股份有限公司
成立于1984年，为金属冲压, 塑胶射出, 电镀等全方位技术能力的精密零组件生产供应制造商。
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